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阿里CEO吴泳铭发布通义千问5-10T参数模型及玄武V900芯片

Speaking at Apsara Conference 2026, Alibaba Group CEO Eddie Wu highlighted the m…

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阿里明确公布下一代Qwen模型的参数量级与RSI技术路线,配合自研芯片发布,是理解国内大模型演进路径的关键一手信息,建议关注后续技术细节。

Speaking at Apsara Conference 2026, Alibaba Group CEO Eddie Wu highlighted the massive frontier ahead: with Machine Thinking currently representing under 3% of human capacity, scaling toward 1,000x opens an unprecedented runway for exponential growth.

在2026年云栖大会上,阿里巴巴集团CEO吴泳铭强调了前方广阔的天地:目前机器思维仅占人类能力的不到3%,向1000倍规模扩展将为指数级增长开辟前所未有的跑道。

To power this future, Alibaba is building across all three pillars: • AI Models: Advancing Recursive Self-Improvement (RSI) with plans for 5–10T parameter Qwen models driving toward ASI. • AI Chips: Introducing the Zhenwu V900—China's most powerful AI chip, scaling up to 500,000 cards per cluster. • AI Cloud: Expanding global data center capacity to exceed 20GW by 2032 to meet boundless demand.

为了赋能这一未来,阿里巴巴正在三大支柱上全面布局: • AI模型:推进递归自我改进(RSI),计划推出参数量达5万亿至10万亿的Qwen模型,推动其向通用人工智能(ASI)迈进。 • AI芯片:发布真武V900——中国最强的AI芯片,单集群可扩展至50万张卡。 • AI云:扩大全球数据中心容量,到2032年将超过20GW,以满足无限的需求。

Stay tuned: https://click.alibabacloud.com/m/20000002869/

敬请期待:https://click.alibabacloud.com/m/20000002869/

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