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长鑫存储量产HBM3E芯片，缩小AI内存差距
China's CXMT makes its first HBM3E chips, closing the AI memory gap
China's top memory maker ChangXin Memory Technologies (CXMT) is producing HBM3E for the first time in small quantities, a fast memory found in many current AI processors.
中国顶级内存制造商长鑫存储（CXMT）正在小批量生产HBM3E，这是一种在许多当前AI处理器中使用的快速内存。
The article China's CXMT makes its first HBM3E chips, closing the AI memory gap appeared first on The Decoder.
文章《中国CXMT制造首批HBM3E芯片，缩小AI内存差距》首发于The Decoder。
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