Cerebras CEO谈AI加速器三大供应链瓶颈及应对
Andrew Feldman, co-founder and CEO of Cerebras explains the 3 major supply-chain…
Andrew Feldman, co-founder and CEO of Cerebras explains the 3 major supply-chain bottlenecks affecting much of the AI accelerator industry:
Cerebras联合创始人兼CEO安德鲁·费尔德曼解释了影响AI加速器行业大部分领域的三大供应链瓶颈：
HBM memory, CoWoS packaging capacity, and access to TSMC’s 3nm manufacturing. Cerebras largely sidesteps all 3 by architectural choice.
HBM内存、CoWoS封装产能，以及台积电3nm制程的获取。Cerebras通过架构选择在很大程度上绕开了这三大瓶颈。
It does not rely on HBM or CoWoS, and its current chips are manufactured on a 5nm process rather than 3nm.
它不依赖HBM或CoWoS，其当前芯片采用5nm工艺而非3nm制造。
In an industry where access to memory, advanced packaging, and leading-edge fabrication capacity can directly constrain shipments, that gives Cerebras a materially different supply profile from the main-street GPU systems.
在一个内存获取、先进封装和前沿制造产能直接制约出货量的行业中，这使Cerebras的供应链状况与主流GPU系统截然不同。
From The MAD Podcast with Matt Turck and Cerebras YouTube channel, (full video link in comment)
来自The MAD Podcast与Matt Turck及Cerebras YouTube频道（完整视频链接见评论）。
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