中国自研EUV原型机取得进展，尚未造出可用芯片
China appears closer to EUV capability without having obtained ASML's production…
China appears closer to EUV capability without having obtained ASML's production-ready machine.
中国似乎更接近EUV能力，而未获得ASML的生产型机器。
The US allegation that an ASML EUV machine reached China remains unverified, and ASML says Washington has provided it no supporting evidence.
美国关于一台ASML EUV机器到达中国的指控尚未得到证实，ASML表示华盛顿未向其提供任何支持证据。
China has, however, reached a different milestone by building its own crude EUV prototype in Shenzhen, reportedly with former ASML engineers and parts sourced from older equipment.
然而，中国通过自行在深圳建造一台粗糙的EUV原型机，达到了另一个里程碑，据报道，该原型机由前ASML工程师参与，并使用旧设备中的部件。
That prototype can generate the required EUV light, but it has not produced working chips, with precision optics still among the hardest unresolved problems.
该原型机能够产生所需的EUV光，但尚未生产出可工作的芯片，精密光学仍是最难解决的关键问题之一。
ASML says it can locate all 340 EUV machines it ever produced, 26 of them decommissioned, since its engineers alone move and service them. Yet components and subsystems travel through a long tail of specialist vendors with no comparable tracking.
ASML表示，它能够定位其生产过的所有340台EUV机器，其中26台已退役，因为只有其工程师才能移动和维护这些机器。然而，组件和子系统通过众多专业供应商的长尾流通，缺乏类似的追踪。
Washington may be aiming at the wrong unit of control. China does not need an ASML-class EUV scanner to weaken the lithography chokepoint.
华盛顿可能瞄准了错误的控制单元。中国并不需要一台ASML级别的EUV扫描仪来削弱光刻瓶颈。
Its prototype already generates EUV light but cannot make working chips, with precision optics among the hardest gaps. Progress can therefore arrive subsystem by subsystem rather than as one finished machine.
其原型机已能产生EUV光，但无法制造出可工作的芯片，精密光学是最难弥补的差距之一。因此，进展可以逐个子系统实现，而非作为一个完整的机器一次性完成。
China's installed DUV fleet already matters because SMIC and Huawei can use multi-patterning to make advanced logic without EUV.
中国已安装的DUV设备群已经很重要，因为中芯国际和华为可以利用多重图案化技术，无需EUV即可制造先进逻辑芯片。
So DUV multi-patterning changes what "too expensive" means in a strategic technology contest. The process requires extra manufacturing steps and produces more defects than EUV, so commercial economics worsen. But when the alternative is no domestic advanced chip, a state-backed program can tolerate costs a merchant foundry would reject.
因此，DUV多重图案化改变了在战略技术竞赛中“过于昂贵”的含义。该过程需要额外的制造步骤，并比EUV产生更多缺陷，因此商业经济性变差。但当替代方案是国内没有先进芯片时，国家支持的方案可以容忍商业代工厂无法接受的成本。
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