AI硬件供应链与市场动态汇总

Just a semi recap TLDR:

• $GLW glass bridge per Morgan Stanley has potential, but hard to displace FAU (like FOCI) in short term
• $SPCX Starlink Gen 3 is scaling to 100,000 units (10x prev gen) creating possible capacity constraints for suppliers of switches to CCL.
• PCB supply shortages are projected to persist until 2028, and component shortages/price hikes are already forcing ODMs like Inventec to issue conservative H2 shipment
• DeepSeek and Zhipu are developing custom ASICs to bypass $NVDA (kinda expected by now).
• Anthropic has achieved a $30B ARR and is projected to hit >$1B in Q3 profit. Turns out these frontier labs are more profitable than people think.
• US admin pressured $AAPL to source from $INTC, in exchange for tariff exception. Kinda pressuring alignment away from TSM.
• $TSM plans a 30x expansion of its Photonic Integrated Circuit (PIC) capacity by 2028, growing from 500 to 25,000 wafers per month
• Hanmi Semiconductor is entering the CoWoS packaging equipment market
• $NVDA and NTT hosting a conference July 24th to discuss CPO strategies.
• 5x general NAND flash price hike this year, market size $489B by next year triggered by RAG/inference. Samsung and SK Hynix make emergency fab investments, NAND equipment suppliers go brrrr.
• Gas turbine bottleneck, 40% supply gap accompanied by staggering 5-year delivery cycles (mega-fabs need them for mass production).
• AI probe card assembly has hit a severe bottleneck apparently. Which is attempted to by solved with things like Innovation Service's machines.
• Nanya, 79.5% gross margins reported, memory go brr. 4x capex for capacity/advanced packaging.
• CXMT's STAR Market IPO on July 16, so should bring a lot of attention to memory players in that supply chain.
• KYEC $1.4B investment into US for $TSM Arizona output test facilities. Lot of these players like $AMKR and others should go brr in 2028.
• $INTC CEO warned last month that helium could hinder the manufacturing costs and delivery times of AI chips
• 3D NAND word lines are shifting from Tungsten to Molybdenum starting at the 375-layer node
• SambaNova secured JPM for AI inference and raised $1B at an $11B valuation.
• HBM prices projections to double in 2027 as $NVDA Rubin platform drives demand.
• $MU provides $500 million in funding to support GlobalWafers' US manufacturing capacity
• $META 'Iris' will enter mass production in September via $AVGO and TSMC and Meta aims to double computing power to 14GW by 2027.
• Largan Precision has secured its first CPO FAU order, mass production slated for middle of next year (kinda indication around Foci and others).
• Samsung and SK Hynix have delayed the implementation of hybrid bonding packaging technology for HBM4 apparently
• Memory costs (DRAM/NAND) have reached 60% of the BOM for sub-$400 smartphones, causing a severe volume contraction.
• SK Hynix successfully rasied $26.5 billion through a Nasdaq ADR
• $TSLA issued procurement guidelines requiring suppliers to reach weekly production of 1,000 units by September and double to 2,000-2,500 by year end for its 3rd gen Optimus robot. Apparently Alliance Technology and A-Link may be in this supply chain harmonic reducers and vision lenses?

Kinda go through all this stuff every day, but don't wanna be a news reporter so just consolidated stuff I found interesting.