B300芯片面积与功耗细节曝光

That's a pretty good way to look at the situation, because a 300mm wafer is a 300mm wafer and every chip no matter the process is pushed close to its thermal limit. B300 has 814mm^2 x 2 die area and 1400W TDP, H100 is half that, 950 is 2 ≈420mm dies and dissipates like H100.